APA

Electronic Productions, .OUTLOOK: Side mounting shrinks chip-scale packages - Low-cost memory test system anticipates RIMM challenges - IrDA standard increases data transfer fourfold - Copper catches on with more IC vendors. - BiCMOS process boosts performance of wireless networking ICs - VHDL extensions advance analog. : .

Chicago

Electronic Productions, .OUTLOOK: Side mounting shrinks chip-scale packages - Low-cost memory test system anticipates RIMM challenges - IrDA standard increases data transfer fourfold - Copper catches on with more IC vendors. - BiCMOS process boosts performance of wireless networking ICs - VHDL extensions advance analog. : .

Harvard

Electronic Productions, .OUTLOOK: Side mounting shrinks chip-scale packages - Low-cost memory test system anticipates RIMM challenges - IrDA standard increases data transfer fourfold - Copper catches on with more IC vendors. - BiCMOS process boosts performance of wireless networking ICs - VHDL extensions advance analog. : .

MLA

Electronic Productions, .: . .